Chiptronics (M) Sdn. Bhd.
 
  BON-6002 & BON-7203 V-cut Solder Machine

Prevention of solder ball scattering


Products Information

Overview & Features
Technical Specification
Contact us:

P: + 604 659 8888
F: + 604 659 2288
E: ctronics@chiptronics.com.my

Features

  • By making V-cut just before soldering, it prevents deterioration of flux and solder ball scattering. In addition,the oozing flux from the v-groove improves the solderability.

  • Using the V-cut machine and BONKOTE LA type soldering iron together at the same time, the prevention of solder ball scattering enable to obtaine its effect more.

  • Solder wires from 0.6~1.6mm in diameter are usable by changeing the guide pulley. 

Specifications

V-cut Solder Machine for Extra-fine solder wire

Features

Solder wires with smaller diameter get the solderability worse because they make the flux scatter and lead the flux reduction.

As compared with the conventional V-cut solder machines, BON-7103 / 7203 has drastically improved the problems of the solder ball acattering by cutting V-groove deeper.  

You do not have to change the cutter or the pulley, but adjust a lever to fit the solder wire diameter.

Introduction of the product
Temperature of the soldering iron tip shold go up to meet the requirement of Lead-free of High density mounting. When the iron tip touches solder wires, the flux vaporizes and scatters together with solder balls. If those solder balls scatters between conductors of electronic parts, they may cuase short-circuit problem. By making V-cut on the solder wire before soldering work, this problem can be improved.
Specifications
 
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